IP Library › Assignment 039902/0302
Patent Assignment
Reel/Frame 039902/0302

Corrective Assignment to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0937. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2016-07-08 Pages: 12
Assignor
UTAC THAI LIMITED
Executed: 2015-05-08
Assignee
UTAC HEADQUARTERS PTE. LTD.
22 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569506, SINGAPORE
Covered Properties (46)
Semiconductor Package Including Organo-Metallic Coating Formed on Surface of Leadframe Roughened Using Chemical Etchant to Prevent Separation Between Leadframe and Molding Compound
Patent: 7,049,683 →
Application: 10/622,346 →
Method of Fabricating No-Lead Package for Semiconductor Die with Half-Etched Leadframe
Patent: 7,153,724 →
Application: 10/637,965 →
Flat No-Lead Semiconductor Die Package Including Stud Terminals
Patent: 7,060,535 →
Application: 10/696,380 →
Method of Fabricating Semiconductor Chip Package Using Screen Printing of Epoxy on Water
Patent: 6,943,061 →
Application: 10/823,280 →
Method and Apparatus for High Speed Singulation
Patent: 7,572,168 →
Application: 11/717,912 →
Lead Frame Land Grid Array
Patent: 8,310,060 →
Application: 11/731,522 →
Very Extremely Thin Semiconductor Package
Patent: 8,575,762 →
Application: 11/788,496 →
Publication: US 2010/0127363
Package with Heat Transfer
Patent: 8,013,437 →
Application: 11/899,189 →
Molded leadframe substrate semiconductor package
Patent: 9,082,607 →
Application: 12/002,186 →
Method of and system for cooling a singulation process
Patent: 8,875,537 →
Application: 12/070,191 →
Method and Apparatus for Plating a Semiconductor Package
Patent: 7,718,522 →
Application: 12/128,828 →
Publication: US 2008/0299756
Method and Apparatus for No Lead Semiconductor Package
Patent: 8,063,470 →
Application: 12/154,483 →
High pressure cooling nozzle for semiconductor package
Patent: 8,449,356 →
Application: 12/220,236 →
Molded Leadframe Substrate Semiconductor Package
Patent: 7,790,512 →
Application: 12/287,174 →
Method for Forming Lead Frame Land Grid Array
Patent: 9,099,317 →
Application: 12/383,135 →
Publication: US 2009/0209064
Method and Apparatus to Prevent Double Semiconductor Units in Test Socket
Patent: 8,334,764 →
Application: 12/567,320 →
Molded Leadframe Substrate Semiconductor Package
Patent: 9,099,294 →
Application: 12/576,846 →
Metallic Solderability Preservation Coating on Metal Part of Semiconductor Package to Prevent Oxide
Patent: 8,367,476 →
Application: 12/579,574 →
Publication: US 2010/0233854
Metallic Solderability Preservation Coating on Metal Part of Semiconductor Package to Prevent Oxide
Patent: 8,569,877 →
Application: 12/579,600 →
Publication: US 2010/0230802
Molded Leadframe Substrate Semiconductor Package
Patent: 8,338,922 →
Application: 12/661,444 →
Leadframe Feature to Minimize Flip-Chip Semiconductor Die Collapse During Flip-Chip Reflow
Patent: 9,449,900 →
Application: 12/834,688 →
Publication: US 2011/0018111
Method and Apparatus for No Lead Semiconductor Package
Patent: 8,071,426 →
Application: 12/838,252 →
Publication: US 2010/0311208
Package with Heat Transfer
Patent: 8,125,077 →
Application: 12/868,560 →
Publication: US 2010/0327432
Flip Chip Cavity Package
Patent: 9,947,605 →
Application: 12/914,694 →
Publication: US 2011/0039371
Auxiliary Leadframe Member for Stabilizing the Bond Wire Process
Patent: 8,368,189 →
Application: 12/960,268 →
Publication: US 2011/0133319
Molded Leadframe Substrate Semiconductor Package
Patent: 9,899,208 →
Application: 12/964,698 →
Publication: US 2011/0076805
Apparatus for and Methods of Attaching Heat Slugs to Package Tops
Patent: 8,871,571 →
Application: 13/019,152 →
Publication: US 2011/0241189
Lead Frame Land Grid Array with Routing Connector Trace Under Unit
Patent: 8,487,451 →
Application: 13/040,112 →
Publication: US 2011/0147931
Leadframe Based Multi Terminal Ic Package
Patent: 8,575,732 →
Application: 13/045,253 →
Publication: US 2011/0221051
Lead Frame Ball Grid Array with Traces Under Die
Patent: 8,492,906 →
Application: 13/080,512 →
Publication: US 2011/0198752
Metallic Solderability Preservation Coating on Metal Part of Semiconductor Package to Prevent Oxide
Patent: 8,431,443 →
Application: 13/156,257 →
Publication: US 2011/0232693
Singulation Method for Semiconductor Package with Plating on Side of Connectors
Patent: 9,349,679 →
Application: 13/214,106 →
Publication: US 2012/0049335
Method of and System for Cooling a Singulation Process
Application: 13/235,124 →
Publication: US 2012/0006528
Apparatus for and Methods of Attaching Heat Slugs to Package Tops
Application: 13/333,897 →
Publication: US 2012/0094438
Lead Frame Land Grid Array
Patent: 8,648,474 →
Application: 13/603,311 →
Publication: US 2013/0234307
Post-Mold for Semiconductor Package Having Exposed Traces
Patent: 9,006,034 →
Application: 13/689,566 →
Lead Frame Ball Grid Array with Traces Under Die Having Interlocking Features
Patent: 8,460,970 →
Application: 13/715,660 →
Lead Frame Ball Grid Array with Traces Under Die Having Interlocking Features
Patent: 8,461,694 →
Application: 13/715,771 →
Leadframe Based Multi Terminal Ic Package
Patent: 8,722,461 →
Application: 13/769,021 →
Publication: US 2013/0210197
Methods of Manufacturing Semiconductor Devices Including Terminals with Internal Routing Interconnections
Patent: 9,029,198 →
Application: 13/850,994 →
Publication: US 2013/0302944
Plated Terminals with Routing Interconnections Semiconductor Device
Patent: 9,449,905 →
Application: 13/851,007 →
Publication: US 2013/0299979
Protruding Terminals with Internal Routing Interconnections Semiconductor Device
Patent: 9,000,590 →
Application: 13/851,822 →
Publication: US 2013/0299980
Molded Leadframe Substrate Semiconductor Package
Patent: 9,093,486 →
Application: 13/886,888 →
Publication: US 2013/0243893
Lead Frame Ball Grid Array with Traces Under Die
Patent: 8,652,879 →
Application: 13/904,931 →
Publication: US 2013/0280866
Lead Frame Land Grid Array with Routing Connector Trace Under Unit
Patent: 8,685,794 →
Application: 13/904,975 →
Publication: US 2013/0337609
Very Extremely Thin Semiconductor Package
Patent: 8,704,381 →
Application: 13/970,392 →
Publication: US 2014/0015117
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 16, 2003
From: LAYSON, ARLENE V.; NONDHASITTHICHAI, SOMCHAI; CHUA, YEE HEONG; SIRINORAKUL,SARAVUTH
To: NS ELECTRONICS BANGKOK (1993) LTD.
Reel/Frame 014200/0086 →
Assignment of Assignor's Interest Jan 9, 2004
From: SIRINORAKUL, SARAVUTH; NONDHASITTHICHAI, SOMCHAI; JEWJAITHAM, SITTA; CHUA, YEE HEONG
To: NS ELECTRONICS OF BANGKOK (1993) LTD.
Reel/Frame 014249/0601 →
Assignment of Assignor's Interest Apr 19, 2004
From: SIRINORAKUL, SARAVUTH; NONDHASITTHICHAI, SOMCHAI; JEWJAITHAM, SITTA
To: NS ELECTRONICS BANGKOK (1993) LTD.
Reel/Frame 015228/0924 →
Assignment of Assignor's Interest Aug 11, 2004
From: SIRINORAKUL, SARAVUTH; SURIYANUN, THADA
To: NS ELECTRONICS BANGKOK (1993) LTD.
Reel/Frame 015018/0419 →
Assignment of Assignor's Interest Mar 13, 2007
From: PHAOWONGSA, APICHART; NONDHASITTHICHAI, SOMCHAI; SAE-LEE, CHARUN; SARARAT, PRAPHAN
To: UTAC THAI LIMITED
Reel/Frame 019089/0678 →
Assignment of Assignor's Interest Mar 30, 2007
From: NONDHASITTHICHAI, SOMCHAI; SIRIORAKUL, SARAVUTH
To: UTAC THAI LIMITED
Reel/Frame 019188/0990 →
Assignment of Assignor's Interest Apr 19, 2007
From: NONDHASITTHICHAI, SOMCHAI; SIRINORAKUL, SARAVUTH
To: UTAC THAI LIMITED
Reel/Frame 019277/0980 →
Corrective Assignment to Correct the Second Inventor's Name. Document Previously Recorded at Reel 019188 Frame 0990. Jul 23, 2007
From: NONDHASITTHICHAI, SOMCHAI; SIRINORAKUL, SARAVUTH
To: UTAC THAI LIMITED
Reel/Frame 019646/0374 →
Assignment of Assignor's Interest Sep 4, 2007
From: SIRINORAKUL, SARAVUTH; NONDHASITTHICHAI, SOMCHAI
To: UTAC THAI LIMITED
Reel/Frame 019836/0579 →
Assignment of Assignor's Interest Feb 15, 2008
From: NONDHASITTHICHAI, SOMCHAI; SIRINORAKUL, SARAVUTH
To: UTAC THAI LIMITED
Reel/Frame 020538/0102 →
Change of Name Feb 25, 2008
From: NS ELECTRONICS BANGKOK (1993) LTD.
To: UTAC THAI LIMITED
Reel/Frame 020550/0925 →
Assignment of Assignor's Interest May 22, 2008
From: SIRINORAKUL, SARAVUTH; NONDHASITTHICHAI, SOMCHAI
To: UTAC THAI LIMITED
Reel/Frame 021070/0736 →
Assignment of Assignor's Interest Jun 11, 2008
From: UTATHIN, SORASAK; KITCHARAENTHAMRONG, SUKUNYA; RABUAPIN, NOPNARINTR
To: UTAC THAI LIMITED
Reel/Frame 021093/0855 →
Assignment of Assignor's Interest Jul 8, 2008
From: SIMITHPIBUL, CHALERMSAK; NONDHASITTHICHAI, SOMCHAI; PHAWONGSA, APICHART
To: UTAC THAI LIMITED
Reel/Frame 021204/0266 →
Assignment of Assignor's Interest Jul 22, 2008
From: SAE-LEE, MR. CHARUN
To: UTAC THAI LIMITED
Reel/Frame 021332/0718 →
Corrective Assignment to Correct Assignee's Address Previously Recorded on Reel 021332, Frame 0718. Oct 3, 2008
From: SAE-LEE, CHARUN
To: UTAC THAI LIMITED
Reel/Frame 021645/0268 →
Assignment of Assignor's Interest Oct 6, 2008
From: SIRINORAKUL, SARAVUTH; NONDHASITTHICHAI, SOMCHAI
To: UTAC THAI LIMITED
Reel/Frame 021725/0748 →
Assignment of Assignor's Interest Mar 19, 2009
From: NONDHASITTHICHAI, SOMCHAI; SIRIORAKUL, SRAVUTH
To: UTAC THAI UNLIMITED
Reel/Frame 022484/0327 →
Assignment of Assignor's Interest May 18, 2009
From: NONDHASITTHICHAI, SOMCHAI; SIRINORAKUL, SARAVUTH
To: UTAC THAI LIMITED
Reel/Frame 022705/0538 →
Assignment of Assignor's Interest Sep 25, 2009
From: NUANWAN, SUWEAT; TAYAPHAT, PRAYOCH; ITDHIAMORNKULCHAI, APICHAI
To: UTAC THAI LIMITED
Reel/Frame 023286/0522 →
Assignment of Assignor's Interest Oct 9, 2009
From: NONDHASITTHICHAI, SOMCHAI; SIRINORAKUL, SARAVUTH
To: UTAC THAI LIMITED
Reel/Frame 023353/0762 →
Assignment of Assignor's Interest Oct 15, 2009
From: BENJAVASUKUL, WORAYA; SOMRUBPORNPINAN, THIPYAPORN; CHARAPAKA, PANIKAN
To: UTAC THAI LIMITED
Reel/Frame 023375/0849 →
Assignment of Assignor's Interest Oct 15, 2009
From: BENJAVASUKUL, WORAYA; SOMRUBPORNPINAN, THIPYAPORN; CHARAPAKA, PANIKAN
To: UTAC THAI LIMITED
Reel/Frame 023375/0714 →
Assignment of Assignor's Interest Mar 16, 2010
From: SIRINORAKUL, SARAVUTH; NONDHASITTHICHAI, SOMCHAI
To: UTAC THAI LIMITED
Reel/Frame 024149/0863 →
Corrective Cover Sheet to Correct Assignee Name Previously Recorded on Reel 022705 Frame 0538. Apr 26, 2010
From: NONDHASITTHICHAI, SOMCHAI; SIRINORAKUL, SARAVUTH
To: UTAC THAI LIMITED
Reel/Frame 024359/0799 →