Method and apparatus for plating a semiconductor package
A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.
1. A method of plating a plurality of semiconductor devices comprising:
applying an electrical power source to an anode terminal and a cathode terminal;
placing said plurality of semiconductor devices on a non-conductive platform in a plating solution;
moving conductive parts across surfaces of said semiconductor devices to be plated, wherein said conductive parts electrically connect said surfaces of said semiconductor devices to said cathode;
wherein plating particles connected to said anode terminal move to and plate said surfaces of said semiconductor devices.
2. The method of claim 1 , wherein said plurality of semiconductor devices are not electrically connected.
3. The method of claim 1 , wherein said conductive parts are shaped as one of spheres, cylinders, polyhedrons, brushes, pins, wheels and hairs.
4. The method of claim 1 , wherein said conductive parts move in a circular direction.
5. A method of plating a plurality of semiconductor devices comprising:
applying an electrical power source to an anode terminal and a cathode terminal;
placing said plurality of semiconductor devices on a non-conductive platform in a plating solution;
moving surfaces of said semiconductor devices to be plated across conductive parts, wherein said conductive parts electrically connect said surfaces of said semiconductor devices to said cathode;
wherein plating particles connected to said anode terminal move to and plate said surfaces of said semiconductor devices.
6. The method of claim 5 , wherein said plurality of semiconductor devices are not electrically connected.
7. The method of claim 5 , wherein said conductive parts are shaped as one of brushes, pins, and hairs.
8. A method of plating a plurality of semiconductor devices comprising:
applying an electrical power source to an anode terminal and a cathode terminal;
placing said plurality of semiconductor devices on a non-conductive platform in a plating solution;
moving conductive parts across surfaces of said semiconductor devices to be plated in a first direction, wherein said semiconductor parts are moving in direction opposite to said first direction, wherein said conductive parts electrically connect said surfaces of said semiconductor devices to said cathode;
wherein plating particles connected to said anode terminal move to and plate said surfaces of said semiconductor devices.
9. The method of claim 8 , wherein said plurality of semiconductor devices are not electrically connected.
10. The method of claim 8 , wherein said conductive parts are shaped as one of spheres, cylinders, polyhedrons, brushes, pins, and hairs.
11. The method of claim 10 , wherein said conductive parts move in a circular direction.