Apparatus for and methods of attaching heat slugs to package tops

1. A method of attaching heat slug pads to packages, the method comprising:

gathering a plurality of packages, wherein each of the plurality of packages is a singulated package;

preparing a heat slug frame including a N×M matrix of heat slug pads coupled together, wherein the preparing step includes coupling each heat slug pad to another heat slug pad using two or more tie bars;

dispensing thermally conductive material onto surfaces of the heat slug pads;

attaching the plurality of packages onto the heat slug pads; and

singulating the heat slug pads to form individual finished products, wherein each of the individual finished products includes a heat slug pad coupled with a singulated package, wherein the singulating step consists of one or more passes across the N×M matrix, wherein the one or more passes are parallel.

2. The method of claim 1 , wherein the gathering step includes singulating the plurality of packages.

3. The method of claim 1 , wherein the preparing step includes forming the heat slug pads by one of etching and stamping.

4. The method of claim 3 , wherein the forming step results in each heat slug pad including a protrusion along a portion of the heat slug pad.

5. The method of claim 4 , wherein the protrusion extends between 0.1 mm and 0.2 mm from an edge of a package coupled to the heat slug.

6. The method of claim 3 , wherein the forming step results in each heat slug pad including at least two walls to position a package therebetween when the package is coupled to the heat slug.

7. The method of claim 3 , wherein at least a portion of the heat slug pad is half the total thickness of the heat slug pad.

8. The method of claim 1 , wherein the preparing step includes marking the heat slug pads with fiducial alignment marks.

9. The method of claim 1 , wherein each heat slug pad has two or more tie bars on each non-adjacent side of the heat slug pad.

10. The method of claim 1 , wherein the preparing step further includes etching the two or more tie bars.

11. The method of claim 1 , wherein the preparing step further includes stamping the two or more tie bars.

12. The method of claim 1 , wherein the attaching step includes aligning the plurality of packages to the heat slug pads according to fiducial alignment marks on the heat slug pads.

13. The method of claim 1 , further comprising, after the attaching step, curing the thermally conductive material.

14. The method of claim 1 , wherein the plurality of packages are wafer level chip scale packages.

15. The method of claim 1 , wherein the plurality of packages are flip-chip quad flat non-lead packages.

16. The method of claim 1 , wherein the plurality of packages are wire-bond quad flat non-lead packages.

17. A method of attaching heat slug foil to packages, the method comprising:

preparing a plurality of packages;

laminating the heat slug foil to one side of the plurality of packages using thermally conductive material, wherein the packages are not singulated from a wafer prior to the lamination of the heat slug foil, wherein the laminating step includes dispensing the thermally conductive material on a passive side of the wafer; and

singulating the plurality of packages from the wafer.

18. The method of claim 17 , further comprising, after the laminating step, curing the thermally conductive material.

19. The method of claim 17 , wherein the plurality of singulated packages are wafer level chip scale packages.

20. The method of claim 17 , wherein the plurality of singulated packages are flip-chip quad flat non-lead packages.

21. The method of claim 17 , wherein the plurality of singulated packages are wire-bond quad flat non-lead packages.

22. The method of claim 1 , wherein at least one of the heat slug pads has varying thickness across the at least one of the heat slug pads.

23. The method of claim 17 , wherein the heat slug foil is substantially planar and has a uniform thickness.

24. The method of claim 17 , wherein the heat slug foil is a thin sheet of metal configured to dissipate heat.

25. The method of claim 17 , wherein in the preparation of the plurality of packages, the plurality of packages have not yet been singulated from a wafer.

26. A method of attaching heat slug pads to packages, the method comprising:

gathering a plurality of packages, wherein each of the plurality of packages is a singulated package;

preparing a heat slug frame including a N×M matrix of heat slug pads coupled together;

dispensing thermally conductive material onto surfaces of the heat slug pads;

attaching the plurality of packages onto the heat slug pads, wherein the attaching step includes picking up each of the plurality of packages and coupling one of the heat slug pads therewith; and

singulating the heat slug pads to form individual finished products, wherein each of the individual finished products includes a heat slug pad coupled with a singulated package, wherein the singulating step consists of one or more passes across the N×M matrix, wherein the one or more passes are parallel.

27. A method of attaching heat slug pads to packages, the method comprising:

gathering a plurality of packages, wherein each of the plurality of packages is a singulated package;

preparing a heat slug frame including a N×M matrix of heat slug pads coupled together, wherein the preparing step includes coupling each heat slug pad to another heat slug pad using two or more tie bars, wherein each heat slug pad has two or more tie bars on each non-adjacent side of the heat slug pad;

dispensing thermally conductive material onto surfaces of the heat slug pads;

attaching the plurality of packages onto the heat slug pads; and

singulating the heat slug pads to form individual finished products, wherein each of the individual finished products includes a heat slug pad coupled with a singulated package, wherein the singulating step consists of one or more passes across the N×M matrix, wherein the one or more passes are parallel.