Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound
A semiconductor package contains a metal leadframe that has been specially treated by roughening it with a chemical etchant. The roughening process enhances the adhesion between the leadframe and the molten plastic during the encapsulation of the leadframe and thereby reduces the tendency of the package to separate when exposed to moisture and numerous temperature cycles. In one embodiment, the leadframe made of copper is roughened with a chemical etchant that contains sulfuric acid and hydrogen peroxide.
1. A semiconductor die package comprising:
a semiconductor die;
a leadframe having a surface roughened by chemical-etching, an organo-metallic coating being formed on said chemically-etched surface; and
a capsule comprising a molding compound, said capsule enclosing at least a portion of said die and at least a portion of said leadframe, said molding compound being in contact with said organo-metallic coating on said chemically-etched surface so as to reduce the possibility of separation between said molding compound and said leadframe as said package undergoes thermal cycles and/or to inhibit the ingress of moisture into said package.
2. The semiconductor package of claim 1 wherein said leadframe consists essentially of copper alloy.
3. The semiconductor package of claim 1 wherein the arithmetic mean deviation of a profile of said chemically-etched surface is in the range of 0.050 μm to 0.170 μm.
4. The semiconductor package of claim 3 wherein the mean peak-to-valley height of said chemically-etched surface is in the range of 0.180 μm to 0.700 μm.
5. The semiconductor package of claim 4 wherein the ten-point height of irregularities of said chemically-etched surface is in the range of 0.400 μm to 1.500 μm.
6. The semiconductor package of claim 4 wherein the maximum profile valley depth of said chemically-etched surface is in the range of 0.200 μm to 0.750 μm.
7. The semiconductor package of claim 5 wherein the maximum profile valley depth of said chemically-etched surface is in the range of 0.200 μm to 0.750 μm.
8. The semiconductor package of claim 3 wherein the ten-point height of irregularities of said chemically-etched surface is in the range of 0.400 μm to 1.500 μm.
9. The semiconductor package of claim 8 wherein the maximum profile valley depth of said chemically-etched surface is in the range of 0.200 μm to 0.750 μm.
10. The semiconductor package of claim 3 wherein the maximum profile valley depth of said chemically-etched surface is in the range of 0.200 μm to 0.750 μm.
11. The semiconductor package of claim 1 wherein the mean peak-to-valley height of said chemically-etched surface is in the range of 0.180 μm to 0.700 μm.
12. The semiconductor package of claim 11 wherein the SILICON VALLEY ten-point height of irregularities of said chemically-etched surface is in the range of 0.400 μm to 1.500 μm.
13. The semiconductor package of claim 12 wherein the maximum profile valley depth of said chemically-etched surface is in the range of 0.200 μm to 0.750 μm.
14. The semiconductor package of claim 11 wherein the maximum profile valley depth of said chemically-etched surface is in the range of 0.200 μm to 0.750 μm.
15. The semiconductor package of claim 1 wherein the ten-point height of irregularities of said chemically-etched surface is in the range of 0.400 μm to 1.500 μm.
16. The semiconductor package of claim 15 wherein the maximum profile valley depth of said chemically-etched surface is in the range of 0.200 μm to 0.750 μm.
17. The semiconductor package of claim 1 wherein the maximum profile valley depth of said chemically-etched surface is in the range of 0.200 μm to 0.750 μm.
18. The semiconductor package of claim 1 wherein a recess is formed in the leadframe, a surface of the leadframe within the recess being chemically-etched.
19. The semiconductor package of claim 1 comprising a plated metal layer on a portion of the leadframe.
20. The semiconductor package of claim 19 wherein a surface of the leadframe under the plated metal layer is chemically-etched.
21. The semiconductor package of claim 19 wherein a surface of the leadframe under the plated metal layer is not chemically-etched.
22. The semiconductor package of claim 1 wherein a top surface or a side surface of said leadframe is chemically-etched and a bottom surface of said leadframe is not chemically-etched.
23. The semiconductor package of claim 1 wherein said chemically-etched surface is light brown to brown in color.
24. The semiconductor package of claim 1 wherein the roughened surface of the leadframe and the organo-metallic coating together reduce the possibility of separation between said molding compound and said leadframe as said package undergoes thermal cycles and/or inhibit the ingress of moisture into said package.
25. A semiconductor package comprising:
a semiconductor die;
a leadframe having a chemically-etched surface; and
a capsule enclosing at least a portion of said die and at least a portion of said leadframe;
said package further comprising an organo-metallic coating on the surface of the leadframe.
26. The semiconductor package of claim 25 wherein the capsule is in contact with the organo-metallic coating so as to reduce the possibility of separation between said capsule and said leadframe as said package undergoes thermal cycles and/or to inhibit the ingress of moisture into said package.
27. The semiconductor package of claim 25 wherein the arithmetic mean deviation of a profile of said chemically-etched surface is in the range of 0.050 μm to 0.170 μm.
28. The semiconductor package of claim 25 wherein the mean peak-to-valley height of said chemically-etched surface is in the range of 0.180 μm to 0.700 μm.
29. The semiconductor package of claim 25 wherein the ten-point height of irregularities of said chemically-etched surface is in the range of 0.400 μm to 1.500 μm.
30. The semiconductor package of claim 25 wherein the maximum profile valley depth of said chemically-etched surface is in the range of 0.200 μm to 0.750 μm.