Patent Assignment
Reel/Frame 020538/0102
Assignment of Assignor's Interest
Recorded: 2008-02-15
Pages: 4
Assignee
UTAC THAI LIMITED
237 LASSALLE ROAD, BANGUA, BANGKOK 10260, THAILAND
Covered Property
(1)
Molded leadframe substrate semiconductor package
Patent:
9,082,607 →
Application:
12/002,186 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 1, 2016
From: UTAC THAI LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037959/0937 →
Corrective Assignment to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0937. Assignor(S) Hereby Confirms the Assignment.
Jul 8, 2016
From: UTAC THAI LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039902/0302 →