Lead frame ball grid array with traces under die
A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.
1. A packaged semiconductor device comprising:
a. a semiconductor die;
b. a plurality of plated routing traces each having a first contact point and at least one additional contact point, wherein the at least one additional contact point includes a plurality of plated layers, and wherein additional contact points of the plurality of plated routing traces includes support structures substantially circumscribing the contact points;
c. a plurality of wirebonds for electrically coupling the semiconductor die to first contact points of the plurality of plated routing traces;
d. a standoff disposed at the at least one additional contact point on a surface opposite from the routing traces; and
e. an encapsulant for encapsulating the semiconductor die such that at least a portion of a plurality of standoffs are exposed.
2. The device of claim 1 wherein the routing traces comprise layers of any among a list of gold, silver, palladium, nickel and any alloy combination thereof.
3. The device of claim 1 wherein the die is mounted to a thermally conductive and electrically insulative adhesive.
4. The device of claim 1 wherein a portion of the plurality of plated routing traces are disposed under the semiconductor die.
5. The device of claim 1 wherein the standoff comprises a portion of an etched monolithic sheet of copper.
6. The device of claim 1 wherein the standoff runs a length of a routing trace from the at least one additional contact point to the first contact point.
7. The device of claim 1 wherein exposed portions of the standoffs are metallized for solderability preservation.
8. The device of claim 1 further comprising an underfill layer for at least partially encapsulating exposed portions of the standoffs.
9. The device of claim 1 further comprising solder balls mounted to at least some of the standoffs for increasing a standoff height of the device.
10. The device of claim 1 wherein the support structures extend outward from the additional contact points.
11. The device of claim 1 wherein an exposed portion of the standoff and a second set of plated layers are metallized.
12. The device of claim 1 wherein the first contact point includes a plurality of plated layers.
13. The device of claim 1 wherein the plurality of standoffs is a platted.