Patent Assignment
Reel/Frame 021332/0718
Assignment of Assignor's Interest
Recorded: 2008-07-22
Pages: 2
Assignor
SAE-LEE, MR. CHARUN
Executed: 2008-07-22
Assignee
UTAC THAI LIMITED
237 LASSALLE ROAD, BANGNA, BANGKOK, 10260, THAILAND
Covered Property
(1)
High pressure cooling nozzle for semiconductor package
Patent:
8,449,356 →
Application:
12/220,236 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct Assignee's Address Previously Recorded on Reel 021332, Frame 0718.
Oct 3, 2008
From: SAE-LEE, CHARUN
To: UTAC THAI LIMITED
Reel/Frame 021645/0268 →
Assignment of Assignor's Interest
Mar 1, 2016
From: UTAC THAI LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037959/0937 →
Corrective Assignment to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0937. Assignor(S) Hereby Confirms the Assignment.
Jul 8, 2016
From: UTAC THAI LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039902/0302 →