Patent Assignment
Reel/Frame 014265/0978
Assignment of Assignor's Interest
Recorded: 2003-07-03
Pages: 2
Assignor
CHA, JAE HAN
Executed: 2003-05-15
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-UEP, ICHON-SHI, KYUNGKI-DO, 467-860, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming an Isolation Film in a Semiconductor Device
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 10, 2005
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016216/0649 →
After-Acquired Intellectual Property Kun-Pledge Agreement
Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
Assignment of Assignor's Interest
May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Partial Release of Security Interest
Aug 10, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 023075/0054 →
Assignment of Assignor's Interest
Aug 12, 2009
From: CROSSTEK CAPITAL, LLC
To: CHUNG CHENG HOLDINGS, LLC
Reel/Frame 023085/0877 →