Patent Assignment
Reel/Frame 014316/0670
Assignment of Assignor's Interest
Recorded: 2003-03-04
Pages: 7
Assignors
ZAVATTARI, CARLO
Executed: 2003-01-28
SEVERICO, FERDINANDO
Executed: 2003-01-28
DE MARIA, PAOLO
Executed: 2003-02-12
Assignee
MEMC ELECTRONIC MATERIALS, S.P.A.
VIALE GHERZI 31, NOVARA, 28100, ITALY
Covered Property
(1)
Wire Saw and Process for Slicing Multiple Semiconductor Ingots
Patent:
6,941,940 →
Application:
10/296,919 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Apr 1, 2011
From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX
To: BANK OF AMERICA, N.A.
Reel/Frame 026064/0720 →
Release of Security Interest
Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Release of Security Interest
Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
Assignment of Assignor's Interest
Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →