Patent Assignment
Reel/Frame 014418/0681
Assignment of Assignor's Interest
Recorded: 2003-08-25
Pages: 3
Assignors
LEE, HYUN BAE
Executed: 2003-06-10
CHOI, JUNG HWAN
Executed: 2003-06-10
KIM, JEONG HUN
Executed: 2003-06-10
Assignee
DONGBU ELECTRONICS CO., LTD.
REPUBLIC OF KOREA, 891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Inspecting Wafer Defects of a Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreeement
Mar 11, 2004
From: IREADY CORPORATION
To: LANZA TECHVENTURE, COLLATERAL AGENT
Reel/Frame 014409/0910 →
Merger
May 31, 2005
From: DONGBU SEMICONDUCTOR INC.
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016593/0667 →
Change of Name
Jun 6, 2006
From: DONGBU ANAM SEMICONDUCTORS, INC
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017718/0964 →