Patent Assignment
Reel/Frame 016593/0667
Merger
Recorded: 2005-05-31
Received: 2005-06-03
Pages: 16
Assignor
DONGBU SEMICONDUCTOR INC.
Executed: 2004-12-21
Assignee
DONGBUANAM SEMICONDUCTOR, INC.
891-10 DAECHI-DONG, KANAGANAM-KU, SEOUL 135-523, KRX, KOREA, REPUBLIC OF
Covered Properties
(87)
Method of making a MOS transistor
Application:
11/044,331 →
Methods of Fabricating Non-Volatile Memory Devices
Application:
11/025,504 →
Methods of Fabricating Semiconductor Devices Having Salicide
Application:
11/010,764 →
Methods of Forming Metal Interconnection Lines in Semiconductor Devices
Application:
11/009,470 →
Methods for Fabricating Semiconductor Devices
Application:
11/010,157 →
Methods for manufacturing semiconductor device
Application:
11/008,524 →
Semiconductor Devices Having Dual Spacers and Methods of Fabricating the Same
Application:
10/971,984 →
Semiconductor Devices and Methods of Fabricating the Same
Application:
10/972,189 →
Semiconductor Devices Having a Capacitor and Methods of Manufacturing the Same
Application:
10/960,216 →
Methods for Forming a Field Effect Transistor
Application:
10/956,311 →
Back Grinding Methods for Fabricating an Image Sensor
Application:
10/956,174 →
Inductors in semiconductor devices and methods of manufacturing the same
Application:
10/956,612 →
Method of Fabricating Flash Memory
Application:
10/950,218 →
Method of Forming a Semiconductor Device Using a Silicide Etching Mask
Application:
10/950,017 →
Methods for Forming a Device Isolation Structure in a Semiconductor Device
Application:
10/946,717 →
Methods for fabricating semiconductor devices
Application:
10/946,155 →
Semiconductor Devices Having Diffusion Barrier Regions and Halo Implant Regions and Methods of Fabricating the Same
Application:
10/944,316 →
Methods for fabricating semiconductor devices
Application:
10/944,115 →
Field Effect Transistors and Methods for Manufacturing Field Effect Transistors
Application:
10/926,874 →
Semiconductor Devices and Methods of Forming a Barrier Metal in Semiconductor Devices
Application:
10/925,777 →
Methods for Fabricating a Copper Interconnect
Application:
10/925,078 →
Methods and Apparatus for Cleaning Semiconductor Devices
Application:
10/918,047 →
Method for Fabricating Metal Wiring and Semiconductor Device Having the Same
Application:
10/902,903 →
Semiconductor Devices and Fabrication Methods Thereof
Application:
10/852,823 →
Methods of Fabricating Self-Aligned Source of Flash Memory Device
Application:
10/758,188 →
Capacitors of Semiconductor Devices and Methods of Fabricating the Same
Application:
10/758,346 →
Method for Fabricating a Metal-Insulator-Metal Capacitor in a Semiconductor Device
Application:
10/758,150 →
Method for Fabricating and-Type Flash Memory Cell
Application:
10/750,250 →
Inorganic Compound for Removing Polymers in Semiconductor Processes
Application:
10/750,248 →
Methods of Fabricating Silicon on Insulator Substrates for Use in Semiconductor Devices
Application:
10/750,251 →
Methods for Fabricating Nonvolatile Memory Devices
Application:
10/750,252 →
Methods of Manufacturing Semiconductor Devices Having Capacitors
Application:
10/750,246 →
Flash Memory with Reduced Source Resistance and Fabrication Method Thereof
Application:
10/749,648 →
Method of Manufacturing Mosfet Having a Fine Gate Width with Improvement of Short Channel Effect
Application:
10/748,466 →
Methods for Forming Shallow Trench Isolation Structures
Application:
10/748,468 →
Methods of Manufacturing Transistors Using Dummy Gate Patterns
Application:
10/748,025 →
Methods of Manufacturing and-Type Flash Memory Devices
Application:
10/749,489 →
Semiconductor Transistors and Methods of Fabricating the Same
Application:
10/749,541 →
Plasma Ignition Method and Apparatus
Application:
10/749,635 →
Method for Forming Metal Lines in a Semiconductor Device
Application:
10/749,485 →
Side Braze Packages
Application:
10/748,428 →
Methods for Manufacturing Semiconductor Devices
Application:
10/749,647 →
Methods for Fabricating Semiconductor Devices
Application:
10/747,599 →
Method for fabricating a transistor
Application:
10/747,601 →
Methods of Manufacturing Semiconductor Devices
Application:
10/747,830 →
Method for Forming Semiconductor Device Bonding Pads
Application:
10/747,603 →
Memory Cell Structures Including a Gap Filling Layer and Methods of Fabricating the Same
Application:
10/747,600 →
Methods for Manufacturing a Semiconductor Device
Application:
10/747,595 →
Methods of Fabricating Semiconductor Devices
Application:
10/747,602 →
Methods of Forming Metal Lines in Semiconductor Devices
Application:
10/746,652 →
Methods of manufacturing a semiconductor device
Application:
10/746,836 →
Methods of Manufacturing Semiconductor Devices
Application:
10/746,837 →
Method of manufacturing a semiconductor device
Application:
10/746,799 →
Methods of Manufacturing Semiconductor Devices
Application:
10/746,805 →
Methods for Fabricating a Semiconductor Device
Application:
10/745,854 →
Method of Fabricating a Semiconductor Device That Includes Removing a Residual Conducting Layer from a Sidewall Spacer Corresponding to a Gate Electrode of a Flash Memory
Application:
10/745,853 →
Methods of Manufacturing Semiconductor Memory Devices
Application:
10/746,802 →
Methods of Manufacturing Mosfets in Semiconductor Devices
Application:
10/745,855 →
Semiconductor Devices and Methods for Fabricating the Same
Application:
10/746,801 →
Methods of manufacturing semiconductor devices
Application:
10/744,717 →
Image Sensors and Methods of Manufacturing the Same
Application:
10/744,189 →
Method of Manufacturing an Eeprom Device
Application:
10/743,483 →
Methods of Preventing Oxidation of Barrier Metal of Semiconductor Devices
Application:
10/743,629 →
Semiconductor Device and Method of Manufacturing the Same
Application:
10/743,113 →
Methods for Forming Capacitors and Contact Holes of Semiconductor Devices Simultaneously
Application:
10/743,608 →
Method for Fabricating a Capacitor Using a Metal Insulator Metal Structure
Application:
10/743,573 →
Apparatus and Methods of Chemical Mechanical Polishing
Application:
10/733,067 →
Methods of Manufacturing Semiconductor Devices
Application:
10/729,227 →
Methods of Manufacturing Semiconductor Devices
Application:
10/726,871 →
Semiconductor Devices and Methods of Manufacturing the Same
Application:
10/722,825 →
Methods of Manufacturing a Semiconductor Device
Application:
10/722,312 →
Method of Forming a Contact in a Semiconductor Device Utilizing a Plasma Treatment
Application:
10/721,978 →
Method for Forming a Contact Using a Dual Damascene Process in Semiconductor Fabrication
Application:
10/712,740 →
Stacked hybrid metal line structures including aluminum-copper-alloy
Application:
10/712,945 →
Method and Apparatus for Forming a Barrier Metal Layer in Semiconductor Devices
Application:
10/701,341 →
Methods for Manufacturing Semiconductor Devices
Application:
10/694,489 →
Methods to Reduce Stress on a Metal Interconnect
Application:
10/694,035 →
Apparatus and methods for slurry flow control
Application:
10/676,643 →
Methods of Fabricating a Mosfet
Application:
10/627,418 →
Method of Making a Mos Transistor
Application:
10/627,059 →
Rf Semiconductor Devices and Methods for Fabricating the Same
Application:
10/627,057 →
Pinned Photodiode for a Cmos Image Sensor and Fabricating Method Thereof
Application:
10/623,389 →
Methods of Making Shallow Trench-Type Pixels for Cmos Image Sensors
Application:
10/606,693 →
Thinning Agent Supplying Systems
Application:
10/458,870 →
Method for Inspecting Wafer Defects of a Semiconductor Device
Application:
10/458,871 →
Cmos Image Sensor
Application:
10/442,898 →
CMOS image sensors
Application:
10/442,613 →