Methods and apparatus for cleaning semiconductor devices

1. A method for cleaning a semiconductor device comprising:

forming a capping layer on top of a substrate including a bottom interconnect layer;

depositing and patterning an insulating layer on the capping layer to form a damascene structure;

etching a portion of the capping layer exposed by the damascene structure; and

removing polymers and copper impurities due to the etching by using a HF vapor gas,

wherein the HF vapor gas is vaporized by supplying N 2 or an inert gas supplied through a high temperature gas injection port to a HF solution in a cleaning apparatus, wherein the high temperature gas injection port supplies N 2 or an inert gas of a temperature to vaporize the HF solution, and wherein the HF vapor gas is vaporized in a gas generating part, where the gas generating part is positioned vertically above the substrate.

2. A method as defined by claim 1 , wherein the capping layer is made of silicon nitride and has a thickness of between about 300 Å and about 600 Å.

3. A method as defined by claim 1 , wherein the insulating layer is made of a low dielectric material through a CVD process.

4. A method as defined by claim 1 , wherein the capping layer is etched through a dry etching process.

5. A method as defined by claim 1 , wherein the HF solution is about 30 mol % to about 40 mol % HF.

6. A method as defined by claim 1 , wherein the temperature of the substrate is maintained between about 60° C. and about 80° C. when removing the polymers and the copper impurities.

7. A method as defined by claim 1 , wherein a temperature of the HF gas is kept between about 40° C. and about 90° C.