Back grinding methods for fabricating an image sensor
View Patent ↗Back grinding methods for fabricating an image sensor are disclosed. An example method of back grinding an image sensor comprises: forming a profile anti-deformation film on a micro lens of the image sensor; grinding a backside of a semiconductor substrate of the image sensor; and removing the profile anti-deformation film.
1. A method of back grinding an image sensor comprising:
forming a profile anti-deformation film comprising a photoresist on a micro lens of the image sensor, wherein a portion of the profile anti-deformation film above the micro lens is two to three times as thick as the micro lens;
grinding a backside of a semiconductor substrate of the image sensor; and
removing the profile anti-deformation film.
2. A method as defined in claim 1 , wherein forming the profile anti-deformation film comprises coating a photoresist on the micro lenses and then solidifying the photoresist.
3. A method as defined in claim 1 , further comprising providing an adhesive on the profile anti-deformation film.
4. A method as defined in claim 3 , further comprising removing the adhesive after grinding the backside of the semiconductor substrate.
5. A method as defined in claim 3 , wherein the adhesive comprises an adhesive tape.
6. A method as defined in claim 1 , wherein removing the profile anti-deformation film comprises chemically removing the profile anti-deformation film.
7. A method as defined in claim 1 , wherein the profile anti-deformation film and the micro lens have a combined thickness of 3 to 4 times a thickness of the micro lens at its uppermost point.
8. A method as defined in claim 1 , wherein the profile anti-deformation film has a thickness from the uppermost point of the micro lens to the top of the profile anti-deformation film that is two to three times as thick as the micro lens at the uppermost point.