Patent Assignment
Reel/Frame 014502/0171
Assignment of Assignor's Interest
Recorded: 2003-09-15
Pages: 3
Assignors
IMAFUJI, KEI
Executed: 2003-08-25
KODAIRA, TADASHI
Executed: 2003-08-25
CHINO, TAKESHI
Executed: 2003-08-25
NAKAMURA, JYUNICHI
Executed: 2003-08-25
ABE, MIWA
Executed: 2003-08-25
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
711, AZA SHARIDEN, OAZA KURITA, NAGANO-SHI, NAGANO, 380-0921, JAPAN
Covered Property
(1)
Method for Producing Wiring Substrate