Patent Assignment
Reel/Frame 014545/0302
Assignment of Assignor's Interest
Recorded: 2003-09-25
Pages: 3
Assignors
HORI, YUKITAKA
Executed: 2003-09-09
SATOH, KATSUMI
Executed: 2003-09-09
ASANO, NORIHISA
Executed: 2003-09-09
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN
Covered Property
(1)
Semiconductor Device Having Sealing Structure for Wide Gap Type Semiconductor Chip