Patent Assignment
Reel/Frame 014559/0822
Assignment of Assignor's Interest
Recorded: 2003-09-26
Pages: 3
Assignor
HITACHI, LTD.
Executed: 2003-09-12
Assignee
RENESAS TECHNOLOGY CORPORATION
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(3)
Semiconductor Device
Semiconductor Device
Method of Fabricating a Semiconductor Device Utilizing a Supporting Plate for Plural Leads
Application:
10/205,448 →
Publication:
US 2002/0192871
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger
Jul 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025204/0512 →
Assignment of Assignor's Interest
May 9, 2014
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 032859/0252 →
Change of Name
May 4, 2017
From: HITACHI HOKKAI SEMICONDUCTOR, LTD.
To: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
Reel/Frame 042247/0398 →
Change of Name
May 4, 2017
From: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042405/0955 →
Merger and Change of Name
May 4, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.; RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042406/0026 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →