IP Library › Assignment 014578/0199
Patent Assignment
Reel/Frame 014578/0199

Assignment of Assignor's Interest

Recorded: 2003-10-06 Pages: 3
Assignors
COMEAU, DOMINIC HAMEL
Executed: 2003-07-07
ROSENBLAT, MICHAEL L.
Executed: 2003-06-26
Assignee
VOIDFORM INTERNATIONAL LTD.
P.O. BOX 277, 75 COLE AVENUE, WINNIPEG, MB, R3C 2H5, CANADA
Covered Property (1)
Mold-Resistant Corrugated Carboard for Void-Forming Structures and Process
Patent: 6,794,017 →
Application: 10/459,287 →
Publication: US 2004/0033343
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 15, 2008
From: VOIDFORM INTERNATIONAL LTD.
To: SONOCO DEVELOPMENT, INC.
Reel/Frame 021230/0626 →
Assignment of Assignor's Interest Jun 3, 2011
From: SONOCO DEVELOPMENT CORPORATION
To: SUREVOID PRODUCTS, INC.
Reel/Frame 026384/0431 →
Change of Name Feb 14, 2013
From: SUREVOID PRODUCTS, INC.
To: VOIDFORM PRODUCTS, INC.
Reel/Frame 029817/0329 →