IP Library Assignment 014594/0472
Patent Assignment
Reel/Frame 014594/0472

Assignment of Assignor's Interest

Recorded: 2003-10-01 Pages: 2
Assignors
KURATOMI, BUNSHI
Executed: 2003-08-07
SHIMIZU, FUKUMI
Executed: 2003-08-07
Assignees
RENESAS TECHNOLOGY CORPORATION
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
3-2, FUJIHASHI 3-CHOME, OME-SHI, TOKYO, JAPAN
Covered Property (1)
Fabrication Method of Semiconductor Integrated Circuit Device
Patent: 7,037,760 →
Application: 10/682,028 →
Publication: US 2004/0166605
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jul 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025204/0512 →
Change of Name May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Merger May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Merger Sep 20, 2017
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 043638/0393 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →