Patent Assignment
Reel/Frame 014598/0204
Assignment of Assignor's Interest
Recorded: 2003-10-15
Pages: 4
Assignor
HITACHI, LTD.
Executed: 2003-09-12
Assignee
RENESAS TECHNOLOGY CORPORATION
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(8)
High frequency power amplifying circuit, and mobile communication apparatus using it
Application:
09/555,010 →
High Frequency Power Amplifier Module, and Wireless Communications System
Semiconductor Device Fabrication Method and Semiconductor Device Fabrication Apparatus
High Frequency Power Amplifying Apparatus Having Amplifying Stages with Gain Control Signals of Lower Amplitudes Applied to Earlier Preceding Stages
Image Input System
High frequency power amplifying circuit, and mobile communication apparatus using it
Application:
10/277,663 →
Publication:
US 2003/0054780
Semiconductor Device
High Frequency Power Amplifier Module and Wireless Communication System
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 22, 2003
From: ISHIZU, AKIO; TAKASHIMA, KAZUTOSHI; OBA, SHIRO; KOBAYASHI, YOSHIHIKO
To: HITACHI, LTD.; HITACHI TOHBU SEMICONDUCTOR, LTD.
Reel/Frame 014521/0949 →
Merger and Change of Name
Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
Merger and Change of Name
May 17, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026287/0075 →
Assignment of Assignor's Interest
Jul 7, 2011
From: RENESAS ELECTRONICS CORPORATION
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 026556/0146 →
Change of Name
Jan 19, 2012
From: HITACHI TOHBU SEMICONDUCTOR, LTD.
To: EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
Reel/Frame 027558/0488 →
Change of Name
Jan 19, 2012
From: EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 027558/0681 →
Assignment of Assignor's Interest
Jan 19, 2012
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 027558/0846 →
Assignment of Assignor's Interest
Mar 21, 2012
From: RENESAS ELECTRONICS CORPORATION
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 027898/0663 →
Assignment of Assignor's Interest
Mar 28, 2012
From: RENESAS ELECTRONICS CORPORATION
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 027946/0388 →
Patent Security Agreement
Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
Release of Security Interest in Patents
Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
Reel/Frame 053654/0254 →
Corrective Assignment to Correct the Assignor Name Previously Recorded on Reel 052853 Frame 0153. Assignor(S) Hereby Confirms the Patent Security Agreement.
Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 053654 Frame: 0254. Assignor(S) Hereby Confirms the Assignment.
Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →