IP Library › Assignment 014614/0408
Patent Assignment
Reel/Frame 014614/0408

Assignment of Assignor's Interest

Recorded: 2003-10-15 Pages: 3
Assignor
LIN, MOU-SHIUNG
Executed: 2003-10-08
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property (1)
Post Passivation Interconnection Schemes on Top of the Ic Chips
Patent: 7,230,340 →
Application: 10/685,872 →
Publication: US 2004/0089951
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017566/0028 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →