Patent Assignment
Reel/Frame 014657/0783
Assignment of Assignor's Interest
Recorded: 2003-10-29
Pages: 3
Assignors
MINAMIO, MASANORI
Executed: 2003-10-20
HORIKI, HIROSHI
Executed: 2003-10-20
FUKUDA, TOSHIYUKI
Executed: 2003-10-20
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA, KADOMA-SHI, OSAKA 571-8501, JAPAN
Covered Property
(1)
Lead Frame and Method of Producing the Same, and Resin-Encapsulated Semiconductor Device and Method of Producing the Same