Assignment of Assignor's Interest

Recorded: 2003-10-31 Pages: 2

Assignor

USAMI, TETSUO

Executed: 2003-09-12

Assignee

OKI ELECTRIC INDUSTRY CO., LTD.

7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Method of Manufacturing Semiconductor Device Having Metal Alloy Interconnection That Has Excellent Em Lifetime

Patent: 6,835,660 →

Application: 10/697,335 →

Publication: US 2004/0092130

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.