Patent Assignment
Reel/Frame 014710/0401
Assignment of Assignor's Interest
Recorded: 2004-06-09
Pages: 3
Assignee
VIA TECHNOLOGIES, INC.
8F, NO. 533, CHUNG-CHENG RD., HSIN-TIEN CITY, TAIPEI HSIEN, TAIWAN
Covered Property
(1)
Electrical Package Capable of Increasing the Density of Bonding Pads and Fine Circuit Lines Inside a Interconnection