Patent Assignment
Reel/Frame 014720/0449
Assignment of Assignor's Interest
Recorded: 2003-07-07
Pages: 2
Assignee
RESLOUTION PERFORMANCE PRODUCTS LLC
1800 SMITH STREET, 24TH FLOOR, P.O. BOX 4500, HOUSTON, TEXAS, 77210-4500
Covered Property
(1)
Epoxy resin composition for semiconductor encapsulation
Application:
10/250,605 →
Publication:
US 2004/0048971
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jan 25, 2005
From: RESOLUTION PERFORMANCE PRODUCTS LLC
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS COLLATERAL AGENT
Reel/Frame 015596/0703 →
Release of Patent Security Agreement
Jan 25, 2005
From: MORGAN STANLEY & CO., INCORPORATED
To: RESOLUTION PERFORMANCE PRODUCTS LLC
Reel/Frame 015603/0117 →
Security Agreement
Aug 31, 2005
From: RESOLUTION PERFORMANCE PRODUCTS LLC; RESOLUTION SPECIALTY MATERIALS LLC; BORDEN CHEMICAL, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 016480/0648 →
Security Agreement
Aug 31, 2005
From: RESOLUTION PERFORMANCE PRODUCTS LLC; RESOLUTION SPECIALTY MATERIALS LLC; BORDEN CHEMICAL, INC.
To: WILMINGTON TRUST COMPANY, AS COLLATERAL AGENT
Reel/Frame 016522/0428 →
Release of Security Interest
Jul 15, 2016
From: WILMINGTON TRUST COMPANY
To: HEXION INC.
Reel/Frame 039360/0724 →