IP Library Assignment 014769/0561
Patent Assignment
Reel/Frame 014769/0561

Assignment of Assignor's Interest

Recorded: 2004-06-23 Pages: 3
Assignor
MASUDA, KAZUHIRO
Executed: 2004-04-27
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO 163-0811, JAPAN
Covered Property (1)
Semiconductor Device, Method of Manufacturing Three-Dimensional Stacking Type Semiconductor Device, Circuit Board, and Electronic Instrument
Patent: 7,141,493 →
Application: 10/799,621 →
Publication: US 2004/0207089
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 2012
From: SEIKO EPSON CORPORATION
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028153/0654 →