Patent Assignment
Reel/Frame 014777/0983
Assignment of Assignor's Interest
Recorded: 2003-12-03
Pages: 3
Assignors
ASAI, KOYU
Executed: 2003-10-30
TOBIMATSU, HIROSHI
Executed: 2003-10-30
KAWATA, HIROYUKI
Executed: 2003-10-30
SAWADA, MAHITO
Executed: 2003-10-30
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-6334, JAPAN
Covered Property
(1)
Interconnection Structure of Semiconductor Device