Patent Assignment
Reel/Frame 014786/0348
Assignment of Assignor's Interest
Recorded: 2003-12-10
Pages: 2
Assignor
RYU, SANG WOOK
Executed: 2003-11-01
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUP, ICHON-SHI, KYUNGKI-DO, 467-860, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Trench in Semiconductor Device
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 10, 2005
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016216/0649 →
After-Acquired Intellectual Property Kun-Pledge Agreement
Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
Release of Security Interest
Jun 22, 2010
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 024563/0807 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 024563 Frame: 0807. Assignor(S) Hereby Confirms the Release by Secured Party.
Nov 25, 2014
From: US BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 034469/0001 →
Assignment of Assignor's Interest
Sep 3, 2020
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: KEY FOUNDRY CO., LTD.
Reel/Frame 053703/0227 →