IP Library Assignment 014821/0349
Patent Assignment
Reel/Frame 014821/0349

Assignment of Assignor's Interest

Recorded: 2003-12-16 Pages: 2
Assignors
TSUTSUI, MAKOTO
Executed: 2003-12-02
NAGASAWA, TOSHIHISA
Executed: 2003-12-02
Assignees
NEC TOKIN CORPORATION
7-1, KORIYAMA 6-CHOME,, TAIHAKU-KU, SENDAI-SHI, MIYAGI, JAPAN
NEC TOKIN TOYAMA, LTD.
560, NYUZEN, NYUZEN-MACHI, SHIMONIKAWA-GUN, TOYAMA, JAPAN
Covered Property (1)
Chip-Type Capacitor, Method of Manufacturing the Same and Molding Die
Patent: 6,882,521 →
Application: 10/738,863 →
Publication: US 2004/0160730
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jun 19, 2017
From: NEC TOKIN TOYAMA, LTD.
To: NEC TOKIN CORPORATION
Reel/Frame 042744/0462 →
Change of Name Jul 7, 2017
From: NEC TOKIN CORPORATION
To: TOKIN CORPORATION
Reel/Frame 043125/0221 →