Merger

Recorded: 2017-06-19 Pages: 12

Assignor

NEC TOKIN TOYAMA, LTD.

Executed: 2006-01-26

Assignee

NEC TOKIN CORPORATION

6-7-1, KOHRIYAMA, TAIHAKU-KU, SENDAI-SHI, MIYAGI, JAPAN

Covered Property (1)

Chip-Type Capacitor, Method of Manufacturing the Same and Molding Die

Patent: 6,882,521 →

Application: 10/738,863 →

Publication: US 2004/0160730

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.