Patent Assignment
Reel/Frame 014826/0830
Assignment of Assignor's Interest
Recorded: 2003-12-17
Pages: 3
Assignors
SAVASTIOUK, SERGEY
Executed: 2003-12-14
HALAHAN, PATRICK B.
Executed: 2003-12-14
KAO, SAM
Executed: 2003-12-14
Assignee
TRU-SI TECHNOLOGIES, INC.
657 N. PASTORIA AVENUE, SUNNYVALE, CALIFORNIA
Covered Property
(1)
Integrated Circuits and Packaging Substrates with Cavities, and Attachment Methods Including Insertion of Protruding Contact Pads into Cavities
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 10, 2011
From: TRU-SI TECHNOLOGIES, INC.
To: ALLVIA, INC.
Reel/Frame 025932/0615 →
Assignment of Assignor's Interest
Mar 13, 2012
From: ALLVIA, INC.
To: INVENSAS CORPORATION
Reel/Frame 027853/0420 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →