Patent Assignment
Reel/Frame 014855/0257
Assignment of Assignor's Interest
Recorded: 2003-12-30
Pages: 2
Assignor
LEE, NAEWON
Executed: 2003-12-26
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Stack Chip Size Packaging Method
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name
May 17, 2005
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016248/0547 →
Change of Name
Jun 7, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017980/0089 →
Assignment of Assignor's Interest
May 28, 2014
From: DONGBU HITEK CO., LTD.
To: DSS TECHNOLOGY MANAGEMENT, INC.
Reel/Frame 033035/0680 →