Patent Assignment
Reel/Frame 016248/0547
Merger and Change of Name
Recorded: 2005-05-17
Pages: 10
Assignor
DONGBU ELECTRONICS CO., LTD.
Executed: 2002-11-21
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10, DAECHI-DONG, KANGNAM-KU, SEOUL, 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Stack Chip Size Packaging Method
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 30, 2003
From: LEE, NAEWON
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014855/0257 →
Change of Name
Jun 7, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017980/0089 →
Assignment of Assignor's Interest
May 28, 2014
From: DONGBU HITEK CO., LTD.
To: DSS TECHNOLOGY MANAGEMENT, INC.
Reel/Frame 033035/0680 →