Patent Assignment
Reel/Frame 014916/0253
Assignment of Assignor's Interest
Recorded: 2004-01-26
Pages: 3
Assignor
YOO, SEUNG JONG
Executed: 2003-12-27
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10, DAECHI-DONG, GANGNAM-GU, SEOUL 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Forming Semiconductor Device Bonding Pads
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.