IP Library Assignment 014939/0882
Patent Assignment
Reel/Frame 014939/0882

Assignment of Assignor's Interest

Recorded: 2004-02-02 Pages: 3
Assignors
PARK, HYUK
Executed: 2003-12-27
KIM, BONG KIL
Executed: 2003-12-27
Assignee
DONGBU ELECTRONICS CO., LTD.
DAECHI-DONG, GANGNAM-GU, SEOUL, 135-523, KOREA, REPUBLIC OF
Covered Property (1)
Memory Cell Structures Including a Gap Filling Layer and Methods of Fabricating the Same
Patent: 7,105,887 →
Application: 10/747,600 →
Publication: US 2004/0142530
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger May 31, 2005
From: DONGBU SEMICONDUCTOR INC.
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016593/0667 →
Change of Name Jun 6, 2006
From: DONGBU ANAM SEMICONDUCTORS, INC
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017718/0964 →