Patent Assignment
Reel/Frame 015017/0063
Assignment of Assignor's Interest
Recorded: 2004-08-11
Pages: 2
Assignor
HONEYWELL ADVANCED CIRCUITS, INC.
Executed: 2003-03-17
Assignee
TTM ADVANCED CIRCUITS, INC.
234 CASHMAN DRIVE, CHIPPEWA FALLS, WISCONSIN, 54729
Covered Property
(1)
Polymer Melting and Extrruding Apparatus with Linear Downstream Threads
Patent:
6,454,454 →
Application:
09/614,180 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement to Patent Security Agreement (Abl)
Jun 6, 2019
From: TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049391/0719 →
Supplement to Patent Security Agreement (Term Loan)
Jun 6, 2019
From: TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049391/0829 →
Merger
Sep 9, 2019
From: TTM ADVANCED CIRCUITS, INC.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 050801/0122 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (049391/0719)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.); TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.)
Reel/Frame 075802/0765 →