IP Library Assignment 075802/0765
Patent Assignment
Reel/Frame 075802/0765

Release of Security Interest in Patents Previously Recorded at Reel/Frame (049391/0719)

Recorded: 2026-06-02 Pages: 6
Assignor
Assignees
TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.)
200 E. SANDPOINTE AVE, SUITE 400, SANTA ANA, CALIFORNIA, 92707
TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.)
200 E. SANDPOINTE AVE, SUITE 400, SANTA ANA, CALIFORNIA, 92707
Covered Properties (2)
Fiber Optic Circuit Connector
Patent: 6,976,793 →
Application: 10/825,980 →
Publication: US US20040197054A1
Polymer Melting and Extrruding Apparatus with Linear Downstream Threads
Patent: 6,454,454 →
Application: 09/614,180 →
Related Assignments (18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 11, 2004
From: HONEYWELL ADVANCED CIRCUITS, INC.
To: TTM ADVANCED CIRCUITS, INC.
Reel/Frame 015017/0063 →
Assignment of Assignor's Interest Jan 19, 2005
From: TOURNE, JOSEPH A.A.M.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 015607/0737 →
Assignment of Assignor's Interest Feb 5, 2010
From: VIASYSTEMS GROUP, INC.
To: VIASYSTEMS, INC.
Reel/Frame 023905/0147 →
Security Agreement Mar 10, 2010
From: VIASYSTEMS, INC.
To: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
Reel/Frame 024062/0634 →
Security Agreement May 4, 2012
From: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 028158/0575 →
Release of Security Interest Jun 8, 2015
From: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
To: VIASYSTEMS, INC.
Reel/Frame 035850/0669 →
Patent Security Agreement-Term Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Release of Security Interest Jun 8, 2015
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION (FORMERLY MERIX CORPORATION)
Reel/Frame 035858/0092 →
Patent Security Agreement-Abl Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Supplement to Patent Security Agreement (Abl) Jun 6, 2019
From: TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049391/0719 →
Supplement to Patent Security Agreement (Term Loan) Jun 6, 2019
From: TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049391/0829 →
Merger Sep 9, 2019
From: TTM ADVANCED CIRCUITS, INC.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 050801/0122 →
Merger May 12, 2023
From: VIASYSTEMS, INC.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 063628/0122 →
Merger May 12, 2023
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 063629/0313 →
Patent Security Agreement (Abl) May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan) May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890) Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702) Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →