Patent Assignment
Reel/Frame 015066/0715
Change of Name
Recorded: 2004-08-17
Pages: 5
Assignor
HITACHI ELECTRONICS ENGINEERING CO., INC.
Executed: 2004-04-01
Assignee
HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
16-3, HIGASHI 3-CHOME SHIBUYA-KU, TOKYO, JAPAN
Covered Property
(1)
Polishing Apparatus with Abrasive Tape, Polishing Method Using Abrasive Tape and Manufacturing Method for Magnetic Disk
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 30, 2004
From: TAJIMA, FUJIO; AMANO, HIDEAKI; TOKUTOMI, TERUAKI; ISHIDA, TAKAHISA
To: HITACHI ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 014947/0319 →
Merger
Sep 7, 2012
From: HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 028921/0370 →