Patent Assignment
Reel/Frame 028921/0370
Merger
Recorded: 2012-09-07
Pages: 38
Assignor
HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
Executed: 2006-04-03
Assignee
HITACHI HIGH-TECHNOLOGIES CORPORATION
24-14, NISHI-SHIMBASHI 1-CHOME, MINATO-KU,, TOKYO, JAPAN
Covered Property
(1)
Polishing Apparatus with Abrasive Tape, Polishing Method Using Abrasive Tape and Manufacturing Method for Magnetic Disk
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 30, 2004
From: TAJIMA, FUJIO; AMANO, HIDEAKI; TOKUTOMI, TERUAKI; ISHIDA, TAKAHISA
To: HITACHI ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 014947/0319 →
Change of Name
Aug 17, 2004
From: HITACHI ELECTRONICS ENGINEERING CO., INC.
To: HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 015066/0715 →