Patent Assignment
Reel/Frame 015079/0559
Assignment of Assignor's Interest
Recorded: 2004-03-11
Pages: 2
Assignors
SHIBATA, AKIJI
Executed: 2004-02-12
OKAMOTO, AKIHIRO
Executed: 2004-02-12
SHIMAZAKI, YOSUKE
Executed: 2004-02-12
KOMIYA, KAZUMOTO
Executed: 2004-02-12
Assignee
HITACHI CABLE, LTD.
6-1, OHTE-MACHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8166, JAPAN
Covered Property
(1)
Mold Die for a Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.