Patent Assignment
Reel/Frame 030766/0460
Assignment of Assignor's Interest
Recorded: 2013-07-10
Pages: 4
Assignor
HITACHI CABLE, LTD.
Executed: 2013-06-28
Assignee
SHINDO COMPANY, LTD.
1-10-5, YOKOAMI, SUMIDA-KU, TOKYO, 130-0015, JAPAN
Covered Properties
(4)
Semiconductor Device Having a Porous Buffer Layer for Semiconductor Device
Patent:
6,433,440 →
Application:
09/092,138 →
Method for Manufacturing Printed Circuit Boards
Mold Die for a Semiconductor Device
Wiring Tape for Semiconductor Device Including a Buffer Layer Having Interconnected Foams
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 1, 2004
From: SHIBATA, AKIJI; TOYOHARU, KOIZUMI; ISHIHARA, TSUYOSHI; SATO, TAKASHI
To: HITACHI CABLE, LTD.
Reel/Frame 015033/0027 →
Assignment of Assignor's Interest
Mar 11, 2004
From: SHIBATA, AKIJI; OKAMOTO, AKIHIRO; SHIMAZAKI, YOSUKE; KOMIYA, KAZUMOTO
To: HITACHI CABLE, LTD.
Reel/Frame 015079/0559 →
Assignment of Assignor's Interest
Nov 5, 2004
From: OGINO, MASAHIKO; EGUCHI, SHUJI; NAGAI, AKIRA; UENO, TAKUMI
To: HITACHI, LTD.; HITACHI CABLE, LTD.
Reel/Frame 015962/0022 →
Corrected Assignment Correcting the Second Inventor's Name in the Notice of Recordation, It Being Noted That Such Error Is on the Part of the U.S. Patent and Trademark Office.
Jan 13, 2005
From: SHIBATA, AKIJI; KOIZUMI, TOYOHARU; ISHIHARA, TSUYOSHI; SATO, TAKASHI
To: HITACHI CABLE, LTD.
Reel/Frame 016154/0095 →
Assignment of Assignor's Interest
Mar 25, 2011
From: HITACHI, LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026109/0976 →
Merger/Change of Name
Aug 31, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026837/0505 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →