IP Library › Assignment 015099/0702
Patent Assignment
Reel/Frame 015099/0702

Assignment of Assignor's Interest

Recorded: 2004-09-01 Pages: 3
Assignors
YANG, CHIN-TIEN
Executed: 2004-07-27
JOU, JUAN-JANN
Executed: 2004-07-27
LEE, YU-HUA
Executed: 2004-07-27
LAI, CHIA-HUNG
Executed: 2004-07-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property (1)
Method for Manufacturing Dual Damascene Structure with a Trench Formed First
Patent: 7,056,821 →
Application: 10/919,328 →
Publication: US 2006/0040498
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 27, 2020
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: TRENCHANT BLADE TECHNOLOGIES LLC
Reel/Frame 052243/0131 →