Patent Assignment
Reel/Frame 015115/0943
Corrective Assignment to Correct the 1ST and 3RD Inventors and Their Doc. Dates. Previously Recorded on Reel 014989 Frame 0407.
Recorded: 2004-09-09
Pages: 5
Assignors
CHEN, CHIEN-HUA
Executed: 2004-01-26
JOHN, BRADLEY C
Executed: 2004-01-26
LANIG, CHARLOTTE R
Executed: 2004-01-23
WORKMAN, MELISSA A
Executed: 2004-01-26
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property
(1)
Wafer Packaging and Singulation Method
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 11, 2004
From: CHEN, CHIEN-HUA; JOHN, BRADLEY C.; LANIG, CHARLOTTE R.; WORKMAN, MELISSA A.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 014989/0407 →
Assignment of Assignor's Interest
Apr 26, 2011
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.; HEWLETT-PACKARD COMPANY
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 026198/0139 →