Patent Assignment
Reel/Frame 015149/0005
Assignment of Assignor's Interest
Recorded: 2004-03-24
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Air Gap Between Semiconductor Substrate and L-Shaped Spacer and Method of Fabricating the Same