IP Library Assignment 015170/0330
Patent Assignment
Reel/Frame 015170/0330

Assignment of Assignor's Interest

Recorded: 2004-04-01 Pages: 3
Assignors
TEZUKA, KOUICHI
Executed: 2003-11-17
FUJII, SEIZO
Executed: 2003-11-17
Assignee
MITSUBISHI RAYON CO., LTD.
6-41, KONAN 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Resin Composition for Plating Substrate and Resin Molding Using the Same, and Metal Plated Parts
Patent: 7,122,251 →
Application: 10/478,218 →
Publication: US 2004/0152808
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 22, 2009
From: MITSUBISHI RAYON CO., LTD.
To: UMG ABS, LTD.
Reel/Frame 022722/0521 →
Assignment of Assignor's Interest Aug 4, 2020
From: UMG ABS, LTD.
To: TECHNO-UMG CO., LTD.
Reel/Frame 053390/0240 →