Patent Assignment
Reel/Frame 022722/0521
Assignment of Assignor's Interest
Recorded: 2009-05-22
Pages: 3
Assignor
MITSUBISHI RAYON CO., LTD.
Executed: 2009-04-28
Assignee
UMG ABS, LTD.
8-1, AKASHI-CHO, CHUO-KU, TOKYO, 104-6591, JAPAN
Covered Property
(1)
Resin Composition for Plating Substrate and Resin Molding Using the Same, and Metal Plated Parts
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.