IP Library › Assignment 053390/0240
Patent Assignment
Reel/Frame 053390/0240

Assignment of Assignor's Interest

Recorded: 2020-08-04 Pages: 3
Assignor
UMG ABS, LTD.
Executed: 2020-05-28
Assignee
TECHNO-UMG CO., LTD.
1-9-2, HIGASHI-SHIMBASHI, MINATO-KU, TOKYO, 105-0021, JAPAN
Covered Properties (2)
Resin Composition for Plating Substrate and Resin Molding Using the Same, and Metal Plated Parts
Patent: 7,122,251 →
Application: 10/478,218 →
Publication: US 2004/0152808
Thermoplastic Resin Composition and Molded Article Thereof
Patent: 9,896,579 →
Application: 15/322,304 →
Publication: US 2017/0137620
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 1, 2004
From: TEZUKA, KOUICHI; FUJII, SEIZO
To: MITSUBISHI RAYON CO., LTD.
Reel/Frame 015170/0330 →
Assignment of Assignor's Interest May 22, 2009
From: MITSUBISHI RAYON CO., LTD.
To: UMG ABS, LTD.
Reel/Frame 022722/0521 →
Assignment of Assignor's Interest Dec 27, 2016
From: IWANAGA, TAKASHI; TAO, KOUSAKU; HASE, NOBUTAKA
To: UMG ABS, LTD.
Reel/Frame 040774/0284 →