Patent Assignment
Reel/Frame 015170/0941
Security Interest
Recorded: 2004-08-26
Pages: 14
Assignor
NANOCONDUCTION, INC.
Executed: 2004-08-19
Assignees
WOODSIDE FUND V, L.P.
350 MARINE PARKWAY. SUITE 300, REDWOOD SHORES, CALIFORNIA, 94065
JERUSALEM VENTURE PARTNERS IV, L.P.
41 MADISON AVENUE, 25TH FLOOR, NEW YORK, NEW YORK, 10010
JERUSALEM VENTURE PARTNERS IV-A, L.P.
41 MADISON AVENUE, 25TH FLOOR, NEW YORK, NEW YORK, 10010
JERUSALEM VENTURE PARTNERS ENTREPRENEURS FUND IV, L.P.
41 MADISON AVENUE, 25TH FLOOR, NEW YORK, NEW YORK, 10010
JERUSALEM VENTURE PARTNERS IV (ISRAEL), L.P.
41 MADISON AVENUE, 25TH FLOOR, NEW YORK, NEW YORK, 10010
Covered Property
(1)
Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits
Application:
10/762,666 →
Publication:
US 2004/0152240
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Aug 26, 2004
From: NANOCONDUCTION, INC.
To: WOODSIDE FUND V, L.P.; JERUSALEM VENTURE PARTNERS IV, L.P.; JERUSALEM VENTURE PARTNERS IV-A, L.P.; JERUSALEM VENTURE PARTNERS ENTREPRENEURS FUND IV, L.P.
Reel/Frame 015736/0585 →
Assignment of Assignor's Interest
Mar 25, 2005
From: DANGELO, CARLOS
To: NANOCONDUCTION, INC.
Reel/Frame 015821/0934 →
Security Agreement
Apr 13, 2006
From: NANOCONDUCTION, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 017782/0927 →
Release of Security Interest
Dec 3, 2010
From: NANOCONDUCTION, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 025446/0431 →
Release of Security Interest
Jan 10, 2011
From: WOODSIDE FUND V, L.P.; JERUSALEM VENTURE PARTNERS IV, L.P.; JERUSALEM VENTURE PARNTERS IV-A, L.P.; JERUSALEM VENTURE PARTNERS ENTERPRENEURS FUND IV, L.P.
To: UNIDYM, INC.; NANOCONDUCTION, INC.
Reel/Frame 025606/0102 →