IP Library › Assignment 025446/0431
Patent Assignment
Reel/Frame 025446/0431

Release of Security Interest

Recorded: 2010-12-03 Pages: 11
Assignor
NANOCONDUCTION, INC.
Executed: 2010-12-02
Assignee
VENTURE LENDING & LEASING IV, INC.
2010 NORTH FIRST STREET, SUITE 310, SAN JOSE, CALIFORNIA, 95131
Covered Properties (15)
System and Method Using Self-Assembled Nano Structures in the Design and Fabrication of an Integrated Circuit Micro-Cooler
Nanoengineered Thermal Materials Based on Carbon Nanotube Array Composites
Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits
Application: 10/762,666 →
Publication: US 2004/0152240
Nanoengineered Thermal Materials Based on Carbon Nanotube Array Composites
Patent: 7,273,095 →
Application: 10/825,795 →
Publication: US 2005/0224220
System and Method Using Self-Assembled Nano Structures in the Design and Fabrication of an Integrated Circuit Micro-Cooler
Patent: 7,109,581 →
Application: 10/925,824 →
Publication: US 2005/0046017
Apparatus and Test Device for the Application and Measurement of Prescribed, Predicted and Controlled Contact Pressure on Wires
Patent: 7,279,916 →
Application: 11/207,096 →
Publication: US 2006/0073712
Method and Apparatus for Establishing Optimal Thermal Contact Between Opposing Surfaces
Application: 11/265,264 →
Publication: US 2007/0097648
Apparatus for Attaching a Cooling Structure to an Integrated Circuit
Patent: 7,477,527 →
Application: 11/386,254 →
Publication: US 2006/0238990
In-Chip Structures and Methods for Removing Heat from Integrated Circuits
Patent: 7,656,027 →
Application: 11/443,669 →
Publication: US 2006/0278901
Integrated Circuit Micro-Cooler Having Multi-Layers of Tubes of a Cnt Array
Patent: 7,538,422 →
Application: 11/532,892 →
Publication: US 2007/0114657
Vapor Chamber Heat Sink Having a Carbon Nanotube Fluid Interface
Patent: 7,732,918 →
Application: 11/748,867 →
Publication: US 2008/0128116
Apparatus and Method for the Application of Prescribed, Predicted, and Controlled Contact Pressure on Wires
Patent: 7,443,185 →
Application: 11/859,477 →
Publication: US 2008/0006391
Matrix methods and applications
Application: 60/663,225 →
Method and apparatus for cooling electronic assemblies using a combination of nano-structured materials, micro-channels and micro-pump devices
Application: 60/663,254 →
In-chip structures and methods for removing heat from integrated circuits
Application: 60/687,289 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest Aug 26, 2004
From: NANOCONDUCTION, INC.
To: WOODSIDE FUND V, L.P.; JERUSALEM VENTURE PARTNERS IV, L.P.; JERUSALEM VENTURE PARTNERS IV-A, L.P.; JERUSALEM VENTURE PARTNERS ENTREPRENEURS FUND IV, L.P.
Reel/Frame 015170/0941 →
Security Agreement Aug 26, 2004
From: NANOCONDUCTION, INC.
To: WOODSIDE FUND V, L.P.; JERUSALEM VENTURE PARTNERS IV, L.P.; JERUSALEM VENTURE PARTNERS IV-A, L.P.; JERUSALEM VENTURE PARTNERS ENTREPRENEURS FUND IV, L.P.
Reel/Frame 015736/0585 →
Assignment of Assignor's Interest Nov 24, 2004
From: MEYYAPPAN, MEYYA
To: NATIONAL AERONAUTICS AND SPACE ADMINISTRATION, UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE
Reel/Frame 015410/0742 →
Assignment of Assignor's Interest Nov 24, 2004
From: LI, JUN
To: NATIONAL AERONAUTICS AND SPACE ADMINISTRATION, USA AS REPRESENTED BY THE ADMINISTRATOR OF THE
Reel/Frame 015410/0363 →
Security Agreement Jan 7, 2005
From: NANOCONDUCTION, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 016130/0479 →
Assignment of Assignor's Interest Mar 25, 2005
From: DANGELO, CARLOS
To: NANOCONDUCTION, INC.
Reel/Frame 015821/0918 →
Assignment of Assignor's Interest Mar 25, 2005
From: DANGELO, CARLOS
To: NANOCONDUCTION, INC.
Reel/Frame 015821/0934 →
Assignment of Assignor's Interest Mar 7, 2006
From: XU, KEVIN; SUHIR, EPHRAIM; DANGELO, CARLOS
To: NANOCONDUCTION INC.
Reel/Frame 017265/0405 →
Assignment of Assignor's Interest Mar 7, 2006
From: SUHIR, EPHRAIM
To: NANOCONDUCTION INC.
Reel/Frame 017264/0046 →
Security Agreement Apr 13, 2006
From: NANOCONDUCTION, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 017782/0927 →
Assignment of Assignor's Interest Jun 15, 2006
From: SUHIR, EPHRAIM
To: NANOCONDUCTION INC.
Reel/Frame 017788/0755 →
Assignment of Assignor's Interest Aug 21, 2006
From: DANGELO, CARLOS; PADMAKUMAR, BALA
To: NANOCONDUCTION, INC.
Reel/Frame 018226/0174 →
Assignment of Assignor's Interest Dec 1, 2006
From: LI, JUN
To: USA AS REPRESENTED BY THE ADMINISTRATOR OF THE NASA
Reel/Frame 018572/0148 →
Assignment of Assignor's Interest Dec 1, 2006
From: MEYYAPPAN, MEYYA
To: USA AS REPRESENTED BY THE ADMINISTRATOR OF THE NASA
Reel/Frame 018572/0156 →
Assignment of Assignor's Interest Feb 12, 2007
From: DANGELO, CARLOS; OLSON, DARIN
To: NANOCONDUCTION INC.
Reel/Frame 018882/0310 →
Assignment of Assignor's Interest Aug 13, 2007
From: DANGELO, CARLOS; SPITZER, JASON
To: NANOCONDUCTION, INC.
Reel/Frame 019682/0301 →
Assignment of Assignor's Interest Aug 22, 2007
From: DANGELO, CARLOS
To: NANOCONDUCTION, INC.
Reel/Frame 019734/0389 →
Lien Sep 17, 2008
From: NANOCONDUCTION, INC.
To: GLENN PATENT GROUP
Reel/Frame 021545/0780 →
Assignment of Assignor's Interest Oct 22, 2008
From: SUHIR, EPHRAIM
To: NANOCONDUCTION INC.
Reel/Frame 021718/0507 →
Release of Security Interest Jul 9, 2010
From: UNIDYM, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 024651/0633 →
Assignment of Assignor's Interest Nov 22, 2010
From: NANOCONDUCTION, INC.
To: UNIDYM, INC.
Reel/Frame 025390/0874 →
Lien Release Dec 1, 2010
From: GLENN PATENT GROUP
To: NANOCONDUCTION, INC. / UNIDYM
Reel/Frame 025434/0839 →
Release of Security Interest Dec 2, 2010
From: VENTURE LENDING & LEASING IV, INC.
To: UNIDYM, INC.
Reel/Frame 025439/0902 →
Release of Security Interest Dec 2, 2010
From: NANOCONDUCTION, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 025438/0509 →
Release of Security Interest Jan 10, 2011
From: WOODSIDE FUND V, L.P.; JERUSALEM VENTURE PARTNERS IV, L.P.; JERUSALEM VENTURE PARNTERS IV-A, L.P.; JERUSALEM VENTURE PARTNERS ENTERPRENEURS FUND IV, L.P.
To: UNIDYM, INC.; NANOCONDUCTION, INC.
Reel/Frame 025606/0102 →