IP Library › Assignment 018226/0174
Patent Assignment
Reel/Frame 018226/0174

Assignment of Assignor's Interest

Recorded: 2006-08-21 Pages: 4
Assignors
DANGELO, CARLOS
Executed: 2006-08-08
PADMAKUMAR, BALA
Executed: 2006-08-16
Assignee
NANOCONDUCTION, INC.
1275 REAMWOOD AVENUE, SUNNYVALE, CALIFORNIA, 94089
Covered Property (1)
In-Chip Structures and Methods for Removing Heat from Integrated Circuits
Patent: 7,656,027 →
Application: 11/443,669 →
Publication: US 2006/0278901
Related Assignments (7)
Other recorded transfers of the patent in this record — the chain of ownership.
Release of Security Interest Jul 9, 2010
From: UNIDYM, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 024651/0633 →
Assignment of Assignor's Interest Nov 22, 2010
From: NANOCONDUCTION, INC.
To: UNIDYM, INC.
Reel/Frame 025390/0874 →
Release of Security Interest Dec 2, 2010
From: NANOCONDUCTION, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 025438/0509 →
Release of Security Interest Dec 2, 2010
From: VENTURE LENDING & LEASING IV, INC.
To: UNIDYM, INC.
Reel/Frame 025439/0902 →
Release of Security Interest Dec 3, 2010
From: NANOCONDUCTION, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 025446/0431 →
Release of Security Interest Jan 10, 2011
From: WOODSIDE FUND V, L.P.; JERUSALEM VENTURE PARTNERS IV, L.P.; JERUSALEM VENTURE PARNTERS IV-A, L.P.; JERUSALEM VENTURE PARTNERS ENTERPRENEURS FUND IV, L.P.
To: UNIDYM, INC.; NANOCONDUCTION, INC.
Reel/Frame 025606/0102 →
Assignment of Assignor's Interest Feb 28, 2011
From: UNIDYM, INC.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025875/0331 →