Patent Assignment
Reel/Frame 025606/0102
Release of Security Interest
Recorded: 2011-01-10
Pages: 6
Assignors
WOODSIDE FUND V, L.P.
Executed: 2009-09-30
JERUSALEM VENTURE PARTNERS IV, L.P.
Executed: 2009-09-30
JERUSALEM VENTURE PARNTERS IV-A, L.P.
Executed: 2009-09-30
JERUSALEM VENTURE PARTNERS ENTERPRENEURS FUND IV, L.P.
Executed: 2009-09-30
JERUSALEM VENTURE PARTNERS IV (ISRAEL), L.P.
Executed: 2009-09-30
Assignees
UNIDYM, INC.
1244 REAMWOOD, SUNNYVALE, CALIFORNIA, 94089
NANOCONDUCTION, INC.
1275 REAMWOOD AVENUE, SUNNYVALE, CALIFORNIA, 94089
Covered Properties
(2)
Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits
Application:
10/762,666 →
Publication:
US 2004/0152240
In-Chip Structures and Methods for Removing Heat from Integrated Circuits
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Aug 26, 2004
From: NANOCONDUCTION, INC.
To: WOODSIDE FUND V, L.P.; JERUSALEM VENTURE PARTNERS IV, L.P.; JERUSALEM VENTURE PARTNERS IV-A, L.P.; JERUSALEM VENTURE PARTNERS ENTREPRENEURS FUND IV, L.P.
Reel/Frame 015736/0585 →
Security Interest
Aug 26, 2004
From: NANOCONDUCTION, INC.
To: WOODSIDE FUND V, L.P.; JERUSALEM VENTURE PARTNERS IV, L.P.; JERUSALEM VENTURE PARTNERS IV-A, L.P.; JERUSALEM VENTURE PARTNERS ENTREPRENEURS FUND IV, L.P.
Reel/Frame 015170/0941 →
Assignment of Assignor's Interest
Mar 25, 2005
From: DANGELO, CARLOS
To: NANOCONDUCTION, INC.
Reel/Frame 015821/0934 →
Security Agreement
Apr 13, 2006
From: NANOCONDUCTION, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 017782/0927 →
Assignment of Assignor's Interest
Aug 21, 2006
From: DANGELO, CARLOS; PADMAKUMAR, BALA
To: NANOCONDUCTION, INC.
Reel/Frame 018226/0174 →
Release of Security Interest
Jul 9, 2010
From: UNIDYM, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 024651/0633 →
Assignment of Assignor's Interest
Nov 22, 2010
From: NANOCONDUCTION, INC.
To: UNIDYM, INC.
Reel/Frame 025390/0874 →
Release of Security Interest
Dec 2, 2010
From: NANOCONDUCTION, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 025438/0509 →
Release of Security Interest
Dec 2, 2010
From: VENTURE LENDING & LEASING IV, INC.
To: UNIDYM, INC.
Reel/Frame 025439/0902 →
Release of Security Interest
Dec 3, 2010
From: NANOCONDUCTION, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 025446/0431 →
Assignment of Assignor's Interest
Feb 28, 2011
From: UNIDYM, INC.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025875/0331 →